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Advanced Failure Determination Measurement Techniques Used in Thermal Fatigue Life Testing of Electronic PackagingThermal fatigue life testing of various electronic packaging technologies is being performed by the Reliability Technology Group at the Jet Propulsion Laboratory. These testing efforts are in progress to improve uderstanding of the reliability issues associated with low volume packaging technologies for space applications and to develop qualification and acceptance approaches for these technologies. The work described here outlines the electrical failure detection techniques used during testing by documenting the circuits and components used to make these measurements, the sensitivity of the measurements, and the applicability of each specific measurement.
Document ID
20060036842
Acquisition Source
Jet Propulsion Laboratory
Document Type
Preprint (Draft being sent to journal)
External Source(s)
Authors
Wallace, A. P.
Cornford, S. L.
Gross, M. A.
Date Acquired
August 23, 2013
Publication Date
January 28, 1996
Subject Category
Electronics And Electrical Engineering
Distribution Limits
Public
Copyright
Other
Keywords
fatigue surface mount measurement testing thermal cycling intermittent detection

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