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High Frequency Electronic Packaging TechnologyCommercial and government communication, radar, and information systems face the challenge of cost and mass reduction via the application of advanced packaging technology. A majority of both government and industry support has been focused on low frequency digital electronics.
Document ID
20060037875
Acquisition Source
Jet Propulsion Laboratory
Document Type
Preprint (Draft being sent to journal)
External Source(s)
hdl:2014/33056
Authors
Herman, M.
Lowry, L.
Lee, K.
Kolawa, E.
Tulintseff, A.
Shalkhauser, K.
Whitaker, J.
Piket-May, M.
Date Acquired
August 23, 2013
Publication Date
November 1, 1994
Subject Category
Electronics And Electrical Engineering
Distribution Limits
Public
Copyright
Other
Keywords
high frequency packaging commercial Materials Science and Radio Frequency (RF)
Engineering manufacturable high frequency

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