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Some Oobservations of the Role of Component Size in Solder Joint Degradation under Thermal Cycling EnvironmentsExperimental results will be presented from a continuing investigation into the influence of component size and configuration of thermal cycling lifetimes, observed in a set of quadpak electronic component packages.
Document ID
20060037904
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/33101
Authors
Winslow, J.
Wen, L-C.
Date Acquired
August 23, 2013
Publication Date
March 26, 1995
Distribution Limits
Public
Copyright
Other
Keywords
thermal cycling lifetimes leadless chip carriers

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