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(abstract) A Brief, Selective Review of Thermal Cycling Fatigue in Eutectic Tin-Lead SolderThis paper reviews selected parts of the current literature relevant to thermo-mechanical fatigue mechanisms in eutectic tin-lead solder, and suggests a general outline to account for some observed failures. The field is found to be complex. One recent experimental study finds some failure modes to be sensitive to joint geometry. Attempts to extrapolate from test environments to service environments have had only limited success. Much work remains to be done before fatigue failures in this material can be considered as under practical control.
Document ID
20060039040
Acquisition Source
Jet Propulsion Laboratory
Document Type
Preprint (Draft being sent to journal)
External Source(s)
Authors
Winslow, J. W.
Silveira, C. de
Date Acquired
August 23, 2013
Publication Date
October 25, 1993
Distribution Limits
Public
Copyright
Other
Keywords
environments
solder tin-lead eutectic thermo-mechanical fatigue test environments service

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