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Rapid qualification of CSP assemblies by increase of ramp rates and cycling temperature rangesTeam members representing government agencies and private companies have joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
Document ID
20060039841
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/36837
Authors
Ghaffarian, R.
Kim, N.
Rose, D.
Hunter, B.
Devitt, K.
Long, T.
Date Acquired
August 23, 2013
Publication Date
September 1, 2001
Distribution Limits
Public
Copyright
Other
Keywords
chip scale package solder joint reliability BGA thermal cycle ramp rate

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