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Characterization of Kova-Pyrex Anodically Bonded Samples: A New Packaging Approach for MEMS DevicesThe ability to anodically bond Kovar to Pyrex 7740 significantly expands the packaging approaches available for MEMS devices. This technique greatly simplifies and reliably interconnects micropropulsion MEMS components (thrusters, valves) with the attached propellant system.
Document ID
20060040463
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
Authors
Vargo, S.
Green, A.
Mueller, J.
Bame, D.
Reinicke, R.
Date Acquired
August 23, 2013
Publication Date
September 18, 2000
Distribution Limits
Public
Copyright
Other
Keywords
anodic bonding packaging Pyrex Kovar

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