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The Application of Microtechnology to Spacecraft On-Board Computing(abstract)In this report, we will survey recent advances in chip packaging and stacking techniques that allow miniature computers to be developed for space applications. Several orders of magnitude reduction in mass, volume, and power consumption are possible using these techniques. Moreover, performance improvements can be achieved by increasing the scale of multiprocessing. Most importantly, long-term survivability can potentially be improved by increasing the level of redundancy and fault tolerance.
Document ID
20060042362
Acquisition Source
Jet Propulsion Laboratory
Document Type
Preprint (Draft being sent to journal)
External Source(s)
Authors
Alkalaj, Leon
Date Acquired
August 23, 2013
Publication Date
January 1, 1993
Distribution Limits
Public
Copyright
Other
Keywords
microtechnology computers multiprocessing packaging fault tolerance

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