NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Collections About News Help Login
Back to Results
Impact of junction temperature on microelectronic device reliability and considerations for space applicationsThis paper provides a summary of an industry survey on junction temperature derating from key microelectronics suppliers, and offers recommendations to users for temperature derating for reliable operation over time. Background information on established derating factors, and reccommendations for safe operating junction temperatures for newer technologies are also presented.
Document ID
20060043542
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/38512
Authors
White, Mark
Chen, Yuan
Cooper, Mark
Date Acquired
August 23, 2013
Publication Date
October 1, 2003
Meeting Information
Meeting: IEEE International Integrated Reliability Workshop
Location: Lake Tahoe, NV
Country: United States
Start Date: October 20, 2003
End Date: October 24, 2003
Distribution Limits
Public
Copyright
Other
Keywords
device reliability
junction temperature

Available Downloads

There are no available downloads for this record.

Related Records

There are no records associated with this record.
No Preview Available