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A comparative analysis of loop heat pipe based thermal architectures for spacecraft thermal controlLoop Heat Pipes (LHP) have gained acceptance as a viable means of heat transport in many spacecraft in recent years. However, applications using LHP technology tend to only remove waste heat from a single component to an external radiator. Removing heat from multiple components has been done by using multiple LHPs. This paper discusses the development and implementation of a Loop Heat Pipe based thermal architecture for spacecraft. In this architecture, a Loop Heat Pipe with multiple evaporators and condensers is described in which heat load sharing and thermal control of multiple components can be achieved. A key element in using a LHP thermal architecture is defining the need for such an architecture early in the spacecraft design process. This paper describes an example in which a LHP based thermal architecture can be used and how such a system can have advantages in weight, cost and reliability over other kinds of distributed thermal control systems. The example used in this paper focuses on a Mars Rover Thermal Architecture. However, the principles described here are applicable to Earth orbiting spacecraft as well.
Document ID
20060043878
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
Authors
Pauken, Mike
Birur, Gaj
Date Acquired
August 23, 2013
Publication Date
September 21, 2004
Meeting Information
Meeting: 13th International Heat Pipe Conference
Location: Shanghai
Country: China
Start Date: September 21, 2004
Distribution Limits
Public
Copyright
Other
Keywords
loop heat pipes
thermal control
thermal systems architecture

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