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Reliability of CCGA and PBGA assembliesArea Array Packages (AAPs) with 1.27 mm pitch have been the packages of the choice for commercial applications; they are now started to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic BGA (PBGA) and CSP assemblies, because of their wide usage for commercial applications, have been extensively reported in literature. Thermal cycling represents the on-off environmental condition for most electronic products and therefore is a key factor that defines reliability.
Document ID
20060044375
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/39605
Authors
Ghaffarian, Reza
Date Acquired
August 23, 2013
Publication Date
February 22, 2005
Meeting Information
Meeting: APEX- Electronic Circuites World Conference
Location: Anaheim, CA
Country: United States
Start Date: February 22, 2005
End Date: February 24, 2005
Distribution Limits
Public
Copyright
Other
Keywords
stakes
solder joints
ball grid array (BGA)
column grid array (CCGA)
inspections
PBGA
thermal cycles
area array packages

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