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Temperature-Adaptive Circuits on Reconfigurable Analog ArraysDemonstration of a self-reconfigurable Integrated Circuit (IC) that would operate under extreme temperature (-180 C and 120 C) and radiation (300krad), without the protection of thermal controls and radiation shields. Self-Reconfigurable Electronics platform: a) Evolutionary Processor (EP) to run reconfiguration mechanism; b) Reconfigurable chip (FPGA, FPAA, etc).
Document ID
20070012325
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/39796
Authors
Stoica, Adrian (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Zebulum, Ricardo S. (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Keymeulen, Didier (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Ramesham, Rajeshuni (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Neff, Joseph (Space and Naval Warfare Systems Command United States)
Katkoori, Srinivas (University of South Florida FL, United States)
Date Acquired
August 23, 2013
Publication Date
June 16, 2006
Subject Category
Electronics And Electrical Engineering
Meeting Information
Meeting: Adaptive Hardware and Systems Conference
Location: Istanbul
Country: Turkey
Start Date: June 16, 2006
End Date: June 18, 2006
Distribution Limits
Public
Copyright
Other
Keywords
self-recovery
Reconfigurable Analog Array (RAA)
extreme temperature electronics

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