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Lead-Free vs Tin-Lead Reliability of Advanced Electronic AssembliesThis presentation will provide the technical background and specific information published in literature related to reliability test, analyses, modeling, and associated issues for lead-free solder package assemblies in comparison to their tin-lead solder alloys. It also presents current understanding of lead-free thermal cycle test performance in support.
Document ID
20070030859
Acquisition Source
Jet Propulsion Laboratory
Document Type
Preprint (Draft being sent to journal)
External Source(s)
hdl:2014/40172
Authors
Ghaffarian, Reza (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Date Acquired
August 24, 2013
Publication Date
December 6, 2005
Subject Category
Electronics And Electrical Engineering
Meeting Information
Meeting: Microelectronic Reliability on Quality Workshop
Location: Manhattan Beach, CA
Country: United States
Start Date: December 6, 2005
End Date: December 7, 2005
Distribution Limits
Public
Copyright
Other
Keywords
assembly reliability
solder
board assembly

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