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Overview of NASA's Thermal Control System Development for Exploration ProjectNASA's Constellation Program includes the Orion, Altair, and Lunar Surface Systems (LSS) project offices. The first two elements, Orion and Altair, are manned space vehicles while the third element is broader and includes several subelements including Rovers and a Lunar Habitat. The upcoming planned missions involving these systems and vehicles include several risks and design challenges. Due to the unique thermal environment, many of these risks and challenges are associated with the vehicles thermal control system. NASA s Exploration Systems Mission Directorate (ESMD) includes the Exploration Technology Development Program (ETDP). ETDP consists of several technology development projects. The project chartered with mitigating the aforementioned risks and design challenges is the Thermal Control System Development for Exploration Project. The risks and design challenges are addressed through a rigorous technology development process that culminates with an integrated thermal control system test. The resulting hardware typically has a Technology Readiness Level (TRL) of approximately six. This paper summarizes the development efforts being performed by the technology development project. The development efforts involve heat acquisition and heat rejection hardware including radiators, heat exchangers, and evaporators. The project has also been developing advanced phase change material heat sinks and performing assessments for thermal control system fluids.
Document ID
20090020500
Acquisition Source
Johnson Space Center
Document Type
Conference Paper
Authors
Stephan, Ryan A.
(NASA Johnson Space Center Houston, TX, United States)
Date Acquired
August 24, 2013
Publication Date
January 1, 2009
Subject Category
Fluid Mechanics And Thermodynamics
Report/Patent Number
09ICES-0351
JSC-CN-18283
Meeting Information
Meeting: 39th International Conference on Environmental Systems
Location: Savannah, GA
Country: United States
Start Date: July 12, 2009
End Date: July 16, 2009
Sponsors: Society of Automotive Engineers, Inc.
Distribution Limits
Public
Copyright
Other

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