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Qualification Testing of Engineering Camera and Platinum Resistance Thermometer (PRT) Sensors for Mars Science Laboratory (MSL) Project under Extreme Temperatures to Assess Reliability and to Enhance Mission AssurancePackage Qualification and Verification (PQV) of advanced electronic packaging and interconnect technologies and various other types of qualification hardware for the Mars Exploration Rover/Mars Science Laboratory flight projects has been performed to enhance the mission assurance. The qualification of hardware (Engineering Camera and Platinum Resistance Thermometer, PRT) under extreme cold temperatures has been performed with reference to various project requirements. The flight-like packages, sensors, and subassemblies have been selected for the study to survive three times (3x) the total number of expected temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware including all relevant manufacturing, ground operations and mission phases. Qualification has been performed by subjecting above flight-like qual hardware to the environmental temperature extremes and assessing any structural failures or degradation in electrical performance due to either overstress or thermal cycle fatigue. Experiments of flight like hardware qualification test results have been described in this paper.
Document ID
20090031830
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
Authors
Ramesham, Rajeshuni
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Maki, Justin N.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Cucullu, Gordon C.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Date Acquired
August 24, 2013
Publication Date
January 19, 2008
Subject Category
Lunar And Planetary Science And Exploration
Meeting Information
Meeting: SPIE Photonics West - MEMS-MOEMS
Location: San Jose, CA
Country: United States
Start Date: January 22, 2008
End Date: January 24, 2008
Sponsors: International Society for Optical Engineering
Distribution Limits
Public
Copyright
Other
Keywords
package reliability
engineering camera
platinum resistance thermometers
package qualifications
hardware qualification
extreme temperatures

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