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Temperature Effects on Adhesive Bond Strengths and Modulus for Commonly Used Spacecraft Structural AdhesivesA study was performed to observe how changes in temperature and substrate material affected the strength and modulus of an adhesive bondline. Seven different adhesives commonly used in aerospace bonded structures were tested. Aluminum, titanium and Invar adherends were cleaned and primed, then bonded using the manufacturer's recommendations. Following surface preparation, the coupons were bonded with the adhesives. The single lap shear coupons were then pull tested per ASTM D 1002 Standard Test Method for Apparent Shear Strength of Single- Lap-Joint over a temperature range from -150 deg C up to +150 deg C. The ultimate strength was calculated and the resulting data were converted into B-basis design allowables. Average and Bbasis results were compared. Results obtained using aluminum adherends are reported. The effects of using different adherend materials and temperature were also studied and will be reported in a subsequent paper. Dynamic Mechanical Analysis (DMA) was used to study variations in adhesive modulus with temperature. This work resulted in a highly useful database for comparing adhesive performance over a wide range of temperatures, and has facilitated selection of the appropriate adhesive for spacecraft structure applications.
Document ID
20120007450
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
Authors
Ojeda, Cassandra E.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Oakes, Eric J.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Hill, Jennifer R.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Aldi, Dominic
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Forsberg, Gustaf A.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Date Acquired
August 25, 2013
Publication Date
May 23, 2011
Subject Category
Chemistry And Materials (General)
Meeting Information
Meeting: SAMPE 2011
Location: Long Beach, CA
Country: United States
Start Date: May 23, 2011
End Date: May 26, 2011
Sponsors: Society for the Advancement of Materials and Process Engineering
Distribution Limits
Public
Copyright
Other
Keywords
structural adhesives testing
bond line strength

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