Review and Assessment of JPL's Thermal Margins

JPL has captured its experience from over four decades of robotic space exploration into a set of design rules. These rules have gradually changed into explicit requirements and are now formally implemented and verified. Over an extended period of time, the initial understanding of intent and rationale for these rules has faded and rules are now frequently applied without further consideration. In the meantime, mission classes and their associated risk postures have evolved, coupled with resource constraints and growing design diversity, bringing into question the current "one size fits all" thermal margin approach. This paper offers a systematic review of the heat flow path from an electronic junction to the eventual heat rejection to space. This includes the identification of different regimes along this path and the associated requirements. The work resulted in a renewed understanding of the intent behind JPL requirements for hot thermal margins and a framework for relevant considerations, which in turn enables better decision making when a deviation to these requirements is considered.