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Scaled CMOS Reliability and Considerations for Spacecraft Systems: Bottom-Up and Top-Down PerspectiveNew space missions will increasingly rely on more advanced technologies because of system requirements for higher performance, particularly in instruments and high-speed processing. Component-level reliability challenges with scaled CMOS in spacecraft systems from a bottom-up perspective have been presented. Fundamental Front-end and Back-end processing reliability issues with more aggressively scaled parts have been discussed. Effective thermal management from system-level to the componentlevel (top-down) is a key element in overall design of reliable systems. Thermal management in space systems must consider a wide range of issues, including thermal loading of many different components, and frequent temperature cycling of some systems. Both perspectives (top-down and bottom-up) play a large role in robust, reliable spacecraft system design.
Document ID
20130010588
Acquisition Source
Jet Propulsion Laboratory
Document Type
Presentation
External Source(s)
Authors
White, Mark
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Date Acquired
August 27, 2013
Publication Date
April 18, 2012
Subject Category
Spacecraft Design, Testing And Performance
Meeting Information
Meeting: 2012 IEEE International Reliability Physics Symposium (IRPS 2012)
Location: Anaheim, CA
Country: United States
Start Date: April 15, 2012
End Date: April 19, 2012
Sponsors: Institute of Electrical and Electronics Engineers
Distribution Limits
Public
Copyright
Other
Keywords
Scaled CMOS
reliability
scaling
system reliability

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