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Advanced Packaging Materials and Techniques for High Power TR Module: Standard Flight vs. Advanced PackagingThe higher output power densities required of modern radar architectures, such as the proposed DESDynI [Deformation, Ecosystem Structure, and Dynamics of Ice] SAR [Synthetic Aperture Radar] Instrument (or DSI) require increasingly dense high power electronics. To enable these higher power densities, while maintaining or even improving hardware reliability, requires advances in integrating advanced thermal packaging technologies into radar transmit/receive (TR) modules. New materials and techniques have been studied and compared to standard technologies.
Document ID
20150006627
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
Authors
Hoffman, James Patrick
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Del Castillo, Linda
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Miller, Jennifer
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Jenabi, Masud
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Hunter, Donald
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Birur, Gajanana
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Date Acquired
April 24, 2015
Publication Date
September 13, 2011
Subject Category
Structural Mechanics
Space Communications, Spacecraft Communications, Command And Tracking
Meeting Information
Meeting: Advanced RF Sensors and Remote Sensing Instruments (ARSI)
Location: Noordwijk
Country: Netherlands
Start Date: September 13, 2011
End Date: September 15, 2011
Sponsors: European Space Agency. European Space Research and Technology Center, ESTEC
Distribution Limits
Public
Copyright
Other
Keywords
Deformation, Ecosystem Structure, and Dynamics of Ice (DESDynI)
thermal dissipation

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