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Reliability of Semiconductor Laser Packaging in Space ApplicationsA typical set up used to perform lifetime tests of packaged, fiber pigtailed semiconductor lasers is described, as well as tests performed on a set of four pump lasers. It was found that two lasers failed after 3200, and 6100 hours under device specified bias conditions at elevated temperatures. Failure analysis of the lasers indicates imperfections and carbon contamination of the laser metallization, possibly from improperly cleaned photo resist. SEM imaging of the front facet of one of the lasers, although of poor quality due to the optical fiber charging effects, shows evidence of catastrophic damage at the facet. More stringent manufacturing controls with 100% visual inspection of laser chips are needed to prevent imperfect lasers from proceeding to packaging and ending up in space applications, where failure can result in the loss of a space flight mission.
Document ID
20150008637
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
Authors
Gontijo, Ivair
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Qiu, Yueming
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Shapiro, Andrew A.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Date Acquired
May 20, 2015
Publication Date
September 1, 2008
Subject Category
Electronics And Electrical Engineering
Meeting Information
Meeting: Electronics System-Integration Technology Conference
Location: London
Country: United Kingdom
Start Date: September 1, 2008
End Date: September 4, 2008
Sponsors: Institute of Electrical and Electronics Engineers
Distribution Limits
Public
Copyright
Other

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