NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Back to Results
Robust, Rework-able Thermal Electronic Packaging: Applications in High Power TR Modules for SpaceThe higher output power densities required of modern radar architectures, such as the proposed DESDynI [Deformation, Ecosystem Structure, and Dynamics of Ice] SAR [Synthetic Aperture Radar] Instrument (or DSI) require increasingly dense high power electronics. To enable these higher power densities, while maintaining or even improving hardware reliability, requires improvements in integrating advanced thermal packaging technologies into radar transmit/receive (TR) modules. New materials and techniques have been studied and are now being implemented side-by-side with more standard technology typically used in flight hardware.
Document ID
20150008799
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
Authors
Hoffman, James Patrick
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Del Castillo, Linda
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Hunter, Don
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Miller, Jennifer
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Date Acquired
May 26, 2015
Publication Date
March 3, 2012
Subject Category
Electronics And Electrical Engineering
Communications And Radar
Meeting Information
Meeting: 2012 IEEE Aerospace Conference
Location: Big Sky, MT
Country: United States
Start Date: March 3, 2012
End Date: March 10, 2012
Sponsors: Institute of Electrical and Electronics Engineers
Distribution Limits
Public
Copyright
Other

Available Downloads

There are no available downloads for this record.
No Preview Available