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Improving Heat Transfer Performance of Printed Circuit BoardsThis paper will explore the ability of printed circuit boards laminated with a Carbon Core Laminate to transfer heat vs. standard printed circuit boards that use only thick layers of copper. The paper will compare the differences in heat transfer performance of printed circuit boards with and without CCL.
Document ID
20150014701
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/45332
Authors
Schatzel, Donald V. (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Date Acquired
August 3, 2015
Publication Date
March 7, 2009
Subject Category
Electronics And Electrical Engineering
Meeting Information
Meeting: IEEE Aerospace Conference
Location: Big Sky, MT
Country: United States
Start Date: March 7, 2009
End Date: March 14, 2009
Sponsors: Institute of Electrical and Electronics Engineers
Distribution Limits
Public
Copyright
Other

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