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Silicon-Carbide Power MOSFET Performance in High Efficiency Boost Power Processing Unit for Extreme EnvironmentsSilicon-Carbide device technology has generated much interest in recent years. With superior thermal performance, power ratings and potential switching frequencies over its Silicon counterpart, Silicon-Carbide offers a greater possibility for high powered switching applications in extreme environment. In particular, Silicon-Carbide Metal-Oxide- Semiconductor Field-Effect Transistors' (MOSFETs) maturing process technology has produced a plethora of commercially available power dense, low on-state resistance devices capable of switching at high frequencies. A novel hard-switched power processing unit (PPU) is implemented utilizing Silicon-Carbide power devices. Accelerated life data is captured and assessed in conjunction with a damage accumulation model of gate oxide and drain-source junction lifetime to evaluate potential system performance at high temperature environments.
Document ID
20160009172
Acquisition Source
Langley Research Center
Document Type
Conference Paper
Authors
Ikpe, Stanley A.
(NASA Langley Research Center Hampton, VA, United States)
Lauenstein, Jean-Marie
(NASA Goddard Space Flight Center Greenbelt, MD, United States)
Carr, Gregory A.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Hunter, Don
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Ludwig, Lawrence L.
(NASA Kennedy Space Center Cocoa Beach, FL, United States)
Wood, William
(NASA Langley Research Center Hampton, VA, United States)
Del Castillo, Linda Y.
(NASA Kennedy Space Center Cocoa Beach, FL, United States)
Fitzpatrick, Fred
(NASA Langley Research Center Hampton, VA, United States)
Chen, Yuan
(NASA Langley Research Center Hampton, VA, United States)
Date Acquired
July 20, 2016
Publication Date
May 10, 2016
Subject Category
Nonmetallic Materials
Report/Patent Number
NF1676L-23816
Meeting Information
Meeting: International Conference on High Temperature Electronics (HiTEC 2016)
Location: Albuquerque, NM
Country: United States
Start Date: May 10, 2016
End Date: May 12, 2016
Sponsors: International Microelectronics and Packaging Society
Funding Number(s)
WBS: WBS 182603.04.07.01
Distribution Limits
Public
Copyright
Public Use Permitted.
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