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Semiconductor wafer improvement through photoengraving Final report, 17 Jun. 1964 - 11 Jan. 1965Preparation of silicon wafer surface before photoresist application to improve resist adhesion - High resolution photoengraving for semiconductor devices
Document ID
19660022996
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Authors
Taylor, C. J. (Westinghouse Electric Corp. Baltimore, MD, United States)
Date Acquired
August 3, 2013
Publication Date
January 1, 1965
Subject Category
Physics, Solid-State
Report/Patent Number
NASA-CR-76745
Report Number: NASA-CR-76745
Accession Number
66N32286
Funding Number(s)
CONTRACT_GRANT: NAS5-2755
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Keywords
ADHESION
SEMICONDUCTOR DEVICE
WAFER
SILICON
PHOTOENGRAVING

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