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Piggy-back mounting would increase microcircuit packaging densityPiggy-back method of packaging integrated circuits will increase packaging density and design flexibility. It will also eliminate interconnection leads between the die and associated inductances, and thus increase the attainable frequency response of the circuit.
Document ID
19680000114
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Gaudiano, S.
Date Acquired
August 4, 2013
Publication Date
April 1, 1968
Subject Category
Electronic Components And Circuits
Report/Patent Number
MSC-12059
Report Number: MSC-12059
Accession Number
68B10114
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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