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Thermoelectric Outer Planets Spacecraft (TOPS) electronic packaging and cabling development summary reportElectronic packaging and cabling activities performed in support of the Thermoelectric Outer Planets Spacecraft (TOPS) Advanced Systems Technology (AST) project are detailed. It describes new electronic compartment, electronic assembly, and module concepts, and a new high-density, planar interconnection technique called discrete multilayer (DML). Development and qualification of high density cabling techniques, using small gage wire and microminiature connectors, are also reported.
Document ID
19750008664
Document Type
Contractor Report (CR)
Authors
Dawe, R. H. (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Arnett, J. C. (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Date Acquired
September 3, 2013
Publication Date
December 15, 1974
Subject Category
ELECTRONICS AND ELECTRICAL ENGINEERING
Report/Patent Number
JPL-TM-33-716
NASA-CR-142087
Funding Number(s)
CONTRACT_GRANT: NAS7-100
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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