Ground/bonding for Large Space System Technology (LSST)

The influence of the environment and extravehicular activity remote assembly operations on the grounding and bonding of metallic and nonmetallic structures is discussed. Grounding and bonding philosophy is outlined for the electrical systems and electronic compartments which contain high voltage, high power electrical and electronic equipment. The influence of plasma and particulate on the system was analyzed and the effects of static buildup on the spacecraft electrical system discussed. Conceptual grounding bonding designs are assessed for capability to withstand high current arcs to ground from a high voltage conductor and electromagnetic interference. Also shown were the extravehicular activities required of the space station and or supply spacecraft crew members to join and inspect the ground system using manual on remote assembly construction.