Effect of strain isolator pad modulus on inplane strain in Shuttle Orbiter thermal protection system tiles

The thermal protection system used on the Space Shuttle orbiter to determine strains in the reusable surface insulation tiles under simulated flight loads was investigated. The effects of changes in the strain isolator pad (SIP) moduli on the strains in the tile were evaluated. To analyze the SIP/tile system, it was necessary to conduct tests to determine inplane tension and compression modulus and inplane failure strain for the densified layer of the tiles. It is shown that densification of the LI-900 tile material increases the modulus by a factor of 6 to 10 and reduces the failure strain by about 50%. It is indicated that the inplane strain levels in the Shuttle tiles in the highly loaded regions are approximately 2 orders of magnitude lower than the failure strain of the material. It is concluded that most of the LI-900 tiles on the Shuttle could be mounted on a SIP with tensile and shear stiffnesses 10 times those of the present SIP without inplane strain failure in the tile.