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Thermoviscoplastic model with application to copperA viscoplastic model is developed which is applicable to anisothermal, cyclic, and multiaxial loading conditions. Three internal state variables are used in the model; one to account for kinematic effects, and the other two to account for isotropic effects. One of the isotropic variables is a measure of yield strength, while the other is a measure of limit strength. Each internal state variable evolves through a process of competition between strain hardening and recovery. There is no explicit coupling between dynamic and thermal recovery in any evolutionary equation, which is a useful simplification in the development of the model. The thermodynamic condition of intrinsic dissipation constrains the thermal recovery function of the model. Application of the model is made to copper, and cyclic experiments under isothermal, thermomechanical, and nonproportional loading conditions are considered. Correlations and predictions of the model are representative of observed material behavior.
Document ID
19890006812
Acquisition Source
Legacy CDMS
Document Type
Technical Publication (TP)
Authors
Freed, Alan D.
(NASA Lewis Research Center Cleveland, OH, United States)
Date Acquired
September 5, 2013
Publication Date
December 1, 1988
Subject Category
Structural Mechanics
Report/Patent Number
E-4280
NAS 1.60:2845
NASA-TP-2845
Report Number: E-4280
Report Number: NAS 1.60:2845
Report Number: NASA-TP-2845
Accession Number
89N16183
Funding Number(s)
PROJECT: RTOP 505-63-31
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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