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Simplified Micromechanics of Plain Weave CompositesA micromechanics based methodology to simulate the complete hygro-thermomechanical behavior of plain weave composites is developed. This methodology is based on micromechanics and the classical laminate theory. The methodology predicts a complete set of thermal, hygral and mechanical properties of plain woven composites, generates necessary data for use in a finite element structural analysis, and predicts stresses all the way from the laminate to the constituent level. This methodology is used in conjunction with a composite mechanics code to analyze and predict the properties/response of a generic graphite/epoxy woven textile composite and a plain weave ceramic composite. The fiber architecture, including the fiber waviness and fiber end distributions through the thickness, is properly accounted for. Predicted results compare reasonably well with those from detailed three-dimensional finite element analyses as well as available experimental data. However, the main advantage of the proposed methodology is its high computational efficiency as compared with three-dimensional finite element analyses.
Document ID
19960017575
Document Type
Technical Memorandum (TM)
Authors
Mital, Subodh K. (Toledo Univ. OH United States)
Murthy, Pappu L. N. (NASA Lewis Research Center Cleveland,OH United States)
Chamis, Christos C. (NASA Lewis Research Center Cleveland,OH United States)
Date Acquired
September 6, 2013
Publication Date
March 1, 1996
Subject Category
Composite Materials
Report/Patent Number
NAS 1.15:107165
NASA-TM-107165
E-10115
Funding Number(s)
PROJECT: RTOP 505-63-12
CONTRACT_GRANT: NAG3-1264
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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NameType 19960017575.pdf STI