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Modeling the Role of Dislocation Substructure During Class M and Exponential CreepThe different substructures that form in the power-law and exponential creep regimes for single phase crystalline materials under various conditions of stress, temperature and strain are reviewed. The microstructure is correlated both qualitatively and quantitatively with power-law and exponential creep as well as with steady state and non-steady state deformation behavior. These observations suggest that creep is influenced by a complex interaction between several elements of the microstructure, such as dislocations, cells and subgrains. The stability of the creep substructure is examined in both of these creep regimes during stress and temperature change experiments. These observations are rationalized on the basis of a phenomenological model, where normal primary creep is interpreted as a series of constant structure exponential creep rate-stress relationships. The implications of this viewpoint on the magnitude of the stress exponent and steady state behavior are discussed. A theory is developed to predict the macroscopic creep behavior of a single phase material using quantitative microstructural data. In this technique the thermally activated deformation mechanisms proposed by dislocation physics are interlinked with a previously developed multiphase, three-dimensional. dislocation substructure creep model. This procedure leads to several coupled differential equations interrelating macroscopic creep plasticity with microstructural evolution.
Document ID
20000003020
Acquisition Source
Legacy CDMS
Document Type
Technical Memorandum (TM)
Authors
Raj, S. V.
(NASA Lewis Research Center Cleveland, OH United States)
Iskovitz, Ilana Seiden
(Ohio Aerospace Inst. Cleveland, OH United States)
Freed, A. D.
(NASA Lewis Research Center Cleveland, OH United States)
Date Acquired
September 7, 2013
Publication Date
August 1, 1995
Publication Information
Publication: Unified Constitutive Laws of Plastic Deformation
Subject Category
Structural Mechanics
Report/Patent Number
E-8491-Rev
NAS 1.15:106986-Rev
NASA-TM-106986-Rev
Funding Number(s)
PROJECT: RTOP 505-63-52
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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