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Risk Management of Microelectronics: The NASA Electronic Parts and Packaging (NEPP) ProgramThis viewgraph information provides information on how the NASA Electronic Parts and Packaging (NEPP) Program evaluates the reliability of technologies for Electrical, Electronic, and Electromechanical (EEE) parts, and their suitability for spacecraft applications.
Document ID
20050180611
Acquisition Source
Goddard Space Flight Center
Document Type
Preprint (Draft being sent to journal)
Authors
LaBel, Kenneth A. (NASA Goddard Space Flight Center Greenbelt, MD, United States)
Sampson, Michael J. (NASA Goddard Space Flight Center Greenbelt, MD, United States)
Date Acquired
September 7, 2013
Publication Date
January 1, 2005
Subject Category
Quality Assurance And Reliability
Meeting Information
Meeting: Government Microcircuits Application Conference
Location: Las Vegas, NV
Country: United States
Start Date: April 6, 2005
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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