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review of polyimides used in the manufacturing of micro systemsSince their invention, polyimides have found numerous uses in MicroElectroMechanical Systems (MEMS) technology. Polyimides can act as photoresist, sacrificial layers, structural layers, and even as a replacement for silicon as the substrate during MEMS fabrication. They enable fabrication of both low and high aspect ratio devices. Polyimides have been used to fabricate expendable molds and reusable flexible molds. Development of a variety of devices that employ polyimides for sensor applications has occurred. Micro-robotic actuator applications include hinges, thermal actuators and residual stress actuators. Currently, polyimides are being used to create new sensors and devices for aerospace applications. This paper presents a review of some of the many uses of polyimides in the development of MEMS devices, including a new polyimide based MEMS fabrication process.
Document ID
20070018345
Document Type
Technical Memorandum (TM)
Authors
Wilson, William C.
(NASA Langley Research Center Hampton, VA, United States)
Atkinson, Gary M.
(Virginia Commonwealth Univ. Richmond, VA, United States)
Date Acquired
August 23, 2013
Publication Date
April 1, 2007
Subject Category
Electronics and Electrical Engineering
Report/Patent Number
L-19339
NASA/TM-2007-214870
Funding Number(s)
WBS: WBS 136905.02.04.04.06
Distribution Limits
Public
Copyright
Public Use Permitted.

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NameType 20070018345.pdf STI