NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Back to Results
Damage Diagnosis in Semiconductive Materials Using Electrical Impedance MeasurementsRecent aerospace industry trends have resulted in an increased demand for real-time, effective techniques for in-flight structural health monitoring. A promising technique for damage diagnosis uses electrical impedance measurements of semiconductive materials. By applying a small electrical current into a material specimen and measuring the corresponding voltages at various locations on the specimen, changes in the electrical characteristics due to the presence of damage can be assessed. An artificial neural network uses these changes in electrical properties to provide an inverse solution that estimates the location and magnitude of the damage. The advantage of the electrical impedance method over other damage diagnosis techniques is that it uses the material as the sensor. Simple voltage measurements can be used instead of discrete sensors, resulting in a reduction in weight and system complexity. This research effort extends previous work by employing finite element method models to improve accuracy of complex models with anisotropic conductivities and by enhancing the computational efficiency of the inverse techniques. The paper demonstrates a proof of concept of a damage diagnosis approach using electrical impedance methods and a neural network as an effective tool for in-flight diagnosis of structural damage to aircraft components.
Document ID
20080015746
Acquisition Source
Langley Research Center
Document Type
Conference Paper
Authors
Ross, Richard W.
(NASA Langley Research Center Hampton, VA, United States)
Hinton, Yolanda L.
(Army Research Lab. Hampton, VA, United States)
Date Acquired
August 24, 2013
Publication Date
April 7, 2008
Subject Category
Air Transportation And Safety
Meeting Information
Meeting: 49th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference
Location: Schaumburg, IL
Country: United States
Start Date: April 7, 2008
End Date: April 10, 2008
Sponsors: American Society of Mechanical Engineers, American Inst. of Aeronautics and Astronautics, American Society for Composites, American Society of Civil Engineers, American Helicopter Society, Inc.
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
No Preview Available