NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Back to Results
SansEC Sensing Technology - A New Tool for Designing Space Systems and ComponentsThis paper presents concepts for using the NASA developed SansEC sensing technology for reconfiguring/modifying many space subsystems to add to their original function the ability to be sensors/sensor arrays without the addition of the electrical circuitry typically used for sensors. Each sensor is a self-resonating planar pattern of electrically conductive material that is an open-circuit single component without electrical connections. The sensors are wirelessly powered using external oscillating magnetic fields and when electrically excited respond with their own magnetic fields whose frequency, amplitude and bandwidth can be correlated with the magnitude of multiple unrelated physical quantities. These sensors have been demonstrated for numerous measurements required for spacecraft and inflatable/expandable structures. SansEC sensors are damage resilient and simple to fabricate. Thin films of conductive material can be used to create sensor arrays that function as sensing skins. Each sensor on the skin can be tailored for a science or engineering measurement. Additionally, each sensor has an inherent damage detection capability. These sensing skins can be used to redesign inflatable habitat multi-layer insulation to provide additional functions of environmental measurement and micrometeorite/orbital debris damage detections. The sensing skins can be deposited on planetary exploratory vehicles to increase the number of measurements with negligible weight increase.
Document ID
20110008236
Acquisition Source
Langley Research Center
Document Type
Conference Paper
Authors
Woodard, Stanley E.
(NASA Langley Research Center Hampton, VA, United States)
Date Acquired
August 25, 2013
Publication Date
March 5, 2011
Subject Category
Spacecraft Instrumentation And Astrionics
Report/Patent Number
NF1676L-11972
IEEE Paper 1434
Meeting Information
Meeting: 2011 IEEE Aerospace Conference
Location: Big Sky, MT
Country: United States
Start Date: March 5, 2011
End Date: March 12, 2011
Sponsors: Institute of Electrical and Electronics Engineers
Funding Number(s)
WBS: WBS 685676.08.04.98.08
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
No Preview Available