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Printed Circuit Board Quality: Copper WrapOutline: Motivation and introduction, requirements in standards and issues, experimental verification, simulation assisted evaluation, lessons learned.
Document ID
20160003315
Acquisition Source
Goddard Space Flight Center
Document Type
Presentation
Authors
Plante, Jeannette (NASA Goddard Space Flight Center Greenbelt, MD United States)
Sood, Bhanu (NASA Goddard Space Flight Center Greenbelt, MD United States)
Daniluk, Kelly (ARES Corp. Greenbelt, MD, United States)
Date Acquired
March 11, 2016
Publication Date
March 10, 2016
Subject Category
Metals And Metallic Materials
Report/Patent Number
GSFC-E-DAA-TN30043
Meeting Information
Meeting: NASA Quality Leadership Forum (QLF)
Location: Cocoa Beach, FL
Country: United States
Start Date: March 9, 2016
End Date: March 10, 2016
Sponsors: NASA OSMA
Distribution Limits
Public
Copyright
Public Use Permitted.
Keywords
PLATING
PCB
WRAP

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