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Gravity Effects in Microgap Flow BoilingIncreasing integration density of electronic components has exacerbated the thermal management challenges facing electronic system developers. The high power, heat flux, and volumetric heat generation of emerging devices are driving the transition from remote cooling, which relies on conduction and spreading, to embedded cooling, which facilitates direct contact between the heat-generating device and coolant flow. Microgap coolers employ the forced flow of dielectric fluids undergoing phase change in a heated channel between devices. While two phase microcoolers are used routinely in ground-based systems, the lack of acceptable models and correlations for microgravity operation has limited their use for spacecraft thermal management. Previous research has revealed that gravitational acceleration plays a diminishing role as the channel diameter shrinks, but there is considerable variation among the proposed gravity-insensitive channel dimensions and minimal research on rectangular ducts. Reliable criteria for achieving gravity-insensitive flow boiling performance would enable spaceflight systems to exploit this powerful thermal management technique and reduce development time and costs through reliance on ground-based testing. In the present effort, the authors have studied the effect of evaporator orientation on flow boiling performance of HFE7100 in a 218 m tall by 13.0 mm wide microgap cooler. Similar heat transfer coefficients and critical heat flux were achieved across five evaporator orientations, indicating that the effect of gravity was negligible.
Document ID
20170004847
Acquisition Source
Goddard Space Flight Center
Document Type
Conference Paper
Authors
Robinson, Franklin
(NASA Goddard Space Flight Center Greenbelt, MD United States)
Bar-Cohen, Avram
(Maryland Univ. College Park, MD, United States)
Date Acquired
June 1, 2017
Publication Date
May 30, 2017
Subject Category
Fluid Mechanics And Thermodynamics
Report/Patent Number
GSFC-E-DAA-TN39852
Meeting Information
Meeting: Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
Location: Lake Buena Vista, FL
Country: United States
Start Date: May 30, 2017
End Date: June 2, 2017
Sponsors: Institute of Electrical and Electronics Engineers
Distribution Limits
Public
Copyright
Public Use Permitted.
Keywords
microscale
boiling
gravity
Two-phase heat transfer
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