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One-Dimensional Model for the Ultrasonic Response of Resin-Filled Gaps in Automated Tape Layup CompositesAutomated tow placement has become a widely used fabrication technique, especially for large aerospace structures. Robotic heads lay down strips (tows) of preimpregnated fiber along programmed paths. The intention is to lay adjacent tows abutted to one another, but sometimes a gap is left between a tow and the previously-placed tow. If a tow gap exists, it fills with resin during cure, forming a fiber-free volume. In immersion ultrasonic pulse-echo measurements of a cured laminate, the gap can be observed to produce a noticeable echo, without significantly attenuating the back-wall reflection of the laminate. To understand this behavior, we considered a one dimensional model of the composite laminate, with a thin layer having the ultrasonic sound speed and density of neat resin, sandwiched between two layers of material having the sound speed and density of fiber-reinforced composite and surrounded on both sides by water. Neglecting attenuation, we considered the transmission and reflection coefficients of each interface, as well as that of the thin resin layer. Using the initial water/composite reflection as a reference, we computed the relative magnitude of the back surface/water reflection in the presence and in the absence of a resin-only layer, as well as the relative magnitude of the reflection arising from a thin resin layer in composite. While the one-dimensional model did not fully match the measurements, it did qualitatively explain the observed behavior.
Document ID
20170009109
Acquisition Source
Langley Research Center
Document Type
Conference Paper
Authors
Johnston, Patrick H.
(NASA Langley Research Center Hampton, VA, United States)
Juarez, Peter D.
(NASA Langley Research Center Hampton, VA, United States)
Date Acquired
September 27, 2017
Publication Date
September 6, 2017
Subject Category
Structural Mechanics
Composite Materials
Report/Patent Number
NF1676L-26722
Report Number: NF1676L-26722
Meeting Information
Meeting: IEEE International Ultrasonics Symposium
Location: Washington, DC
Country: United States
Start Date: September 6, 2017
End Date: September 9, 2017
Sponsors: Institute of Electrical and Electronics Engineers
Funding Number(s)
WBS: WBS 826611.04.07.02
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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