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2.5/3D Packaging Technology Challenges for Space Components
External Source
jpl
Document Type
Slides (Viewgraph)
Authors
Suh, Eric Jong-ook
Riendeau, Joseph
Date Acquired
September 19, 2024
Publication Date
June 14, 2021
Publication Information
Publisher: Pasadena, CA: Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2021
DOI: http://hdl.handle.net/2014/55325
Distribution Limits
Public

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