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New method forms bond line free of voidsA new bonding method using vacuum, pressure and heat, which produces a bond line free of voids, is described. This method is very successful in bonding ablation shields to a magnesium structural component in simulated reentry tests involving great heat and air turbulence.
Document ID
19630000108
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
King, C. B.
Date Acquired
August 1, 2013
Publication Date
October 1, 1964
Subject Category
Mechanics
Report/Patent Number
LAR-20
Report Number: LAR-20
Accession Number
63B10558
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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