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HEAT-SINKING TECHNIQUES FOR POWER TRANSISTORS IN A SPACE ENVIRONMENTReduction of thermal resistance between a power transistor case and a heat sink in space, through insertion of indium foils
Document ID
19630024959
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
Authors
Hilliard, J. J.
John, J. E. A.
Date Acquired
August 1, 2013
Publication Date
June 1, 1963
Subject Category
Electronic Equipment
Accession Number
63A21018
Distribution Limits
Public
Copyright
Other
Keywords
THERMAL CONDUCTOR
HEAT SINK
TRANSISTOR

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