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Screening technique makes reliable bond at room temperatureStainless-steel screen used to lay room temperature curing epoxy adhesive permits reliable bonding of electronic circuits boards. This technique would be useful with thin-walled structures that warp during conventional bonding operations.
Document ID
19650000004
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Date Acquired
August 2, 2013
Publication Date
January 1, 1965
Subject Category
Materials
Report/Patent Number
MFS-227
Report Number: MFS-227
Accession Number
65B10004
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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