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Thermocompression bonding produces efficient surface-barrier diodeThermocompression bonding of a gold wire to a gallium-arsenide wafer produces a quality surface barrier diode with fast recovery times. The properties of this combination may be useful in semiconductor devices.
Document ID
19650000007
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Date Acquired
August 2, 2013
Publication Date
January 1, 1965
Subject Category
Mechanics
Report/Patent Number
JPL-SC-066
Report Number: JPL-SC-066
Accession Number
65B10007
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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