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Use of tear ring permits repair of sealed module circuitryImproved packaging technique for modular electronic circuitry utilizes a tear ring which may be removed for repair and resealed. The tear ring is put over the container and header to which the electronic circuit assembly has been attached.
Document ID
19650000014
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Date Acquired
August 2, 2013
Publication Date
January 1, 1965
Subject Category
Mechanics
Report/Patent Number
MFS-210
Report Number: MFS-210
Accession Number
65B10014
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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