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Electronic modules easily separated from heat sinkMetal heat sink and electronic modules bonded to a thermal bridge can be easily cleaved for removal of the modules for replacement or repair. A thin film of grease between a fluorocarbon polymer film on the metal heat sink and an adhesive film on the modules acts as the cleavage plane.
Document ID
19650000184
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Date Acquired
August 2, 2013
Publication Date
June 1, 1965
Subject Category
Physical Sciences
Report/Patent Number
MSC-142
Report Number: MSC-142
Accession Number
65B10186
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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