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Thermoelectric elements diffusion-bonded to tungsten electrodesSolid-state diffusion process bonds lead telluride and lead telluride-tin telluride thermoelectric elements to tungsten electrodes. The resulting bond is nonmagnetic and has high strength and low electrical and thermal resistance. This method is also used with tantalum electrodes.
Document ID
19650000307
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Date Acquired
August 2, 2013
Publication Date
October 1, 1965
Subject Category
Electronic Components And Circuits
Report/Patent Number
GSC-346
Report Number: GSC-346
Accession Number
65B10309
Funding Number(s)
CONTRACT_GRANT: NAS5-3986
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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