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System for etching thick aluminum layers minimizes bridging and undercuttingFour step photoresist process for etching thick aluminum layers for semiconductor device contacts produces uniform contact surfaces, eliminates bridging, minimizes undercutting, and may be used on various materials of any thickness.
Document ID
19660000399
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Date Acquired
August 3, 2013
Publication Date
September 1, 1966
Subject Category
Materials
Report/Patent Number
MFS-1366
Report Number: MFS-1366
Accession Number
66B10400
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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