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Evaluation of several silicone, phenolic, and expoxy base heat-shield materials at various heat-transfer rates and dynamic pressuresElastomeric and rigid silicone, epoxy, and phenol resin base ablating materials evaluated at various heat transfer rates and dynamic pressures
Document ID
19660028849
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Technical Note (TN)
Authors
Chapman, A. J. (NASA Langley Research Center Hampton, VA, United States)
Date Acquired
September 2, 2013
Publication Date
October 1, 1966
Subject Category
Materials, Nonmetallic
Report/Patent Number
NASA-TN-D-3619
Report Number: NASA-TN-D-3619
Accession Number
66N38139
Funding Number(s)
CONTRACT_GRANT: 124-08-03-10-23
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Keywords
PHENOL RESIN
DYNAMIC PRESSURE
HEAT TRANSFER
SILICONE RESIN
EPOXY RESIN
ABLATING MATERIAL

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