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A thermal insulation and structural support for thermoelectric devices.Thermal insulation and structural support for thermoelectric devices, discussing fabrication of diffusion bonded structures in conjunction with material selection
Document ID
19660062831
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Ketchman, J. J.
Wittman, R. H.
Date Acquired
August 3, 2013
Publication Date
January 1, 1966
Subject Category
Thermodynamics And Combustion
Accession Number
66A42121
Funding Number(s)
CONTRACT_GRANT: NAS5-9160
Distribution Limits
Public
Copyright
Other
Keywords
DIFFUSION BONDING
THERMAL INSULATION
THERMOELECTRIC MATERIAL

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