NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Collections About News Help Login

Press Enter or click the Search button to begin your search.

Back to Results
Reparable, high-density microelectronic module provides effective heat sinkReparable modular system is used for packaging microelectronic flat packs and miniature discrete components. This three-dimensional compartmented structure incorporates etched phosphor bronze sheets and frames with etched wire conductors. It provides an effective heat sink for electric power dissipation in the absence of convective cooling means.
Document ID
19670000356
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Carlson, K. J.
Maytone, F. F.
Date Acquired
August 3, 2013
Publication Date
October 1, 1967
Subject Category
Electronic Components And Circuits
Report/Patent Number
MFS-13075
Report Number: MFS-13075
Accession Number
67B10356
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

Related Records

There are no records associated with this record.
No Preview Available