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Adhesives for laminating polyimide insulated flat conductor cablePolymer adhesive laminates polyimide-film flat conductor cable. It is obtained by reacting an appropriate diamine with a dianhydride. The adhesive has also been used in the lamination of copper to copper for the preparation of multilayer circuit boards.
Document ID
19670000429
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Montermoso, J. C.
Saxton, T. R.
Taylor, R. L.
Date Acquired
August 3, 2013
Publication Date
November 1, 1967
Subject Category
Materials
Report/Patent Number
MFS-12066
Report Number: MFS-12066
Accession Number
67B10429
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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